JSYAPG‑S001 water‑based nano polishing slurry is a precision CMP finishing fluid formulated with carefully proportioned colloidal silica and colloidal alumina nano‑abrasives in high‑purity deionized water. It contains selected pH regulators, surface wetting agents and dispersing additives without coarse grit contamination. This nano‑slurry is engineered for ultra‑fine nano‑finish processing of semiconductor wafers, optical components and LCD glass substrates. It provides controllable material re

Product Detail

Product Detail Page: JSYAPG‑S001 nano polishing slurry is produced using high‑purity colloidal silica and colloidal alumina as core abrasives. Nano‑particles are strictly screened to eliminate oversized particles and hard agglomerates through multi‑stage filtration. Deionized water serves as the aqueous carrier, matched with pH adjusting agents and high‑efficiency dispersants to maintain stable particle suspension during circulation. The production process is performed under controlled clean conditions to minimize foreign particulate and ionic contaminants.

Semiconductor wafer, optical elements and LCD glass substrates require extremely smooth surface at nanometer scale. Residual micro‑scratches and subsurface damage on these substrates will generate severe negative consequences. For semiconductor wafers, tiny surface scratches will cause circuit defects in subsequent photolithography and etching processes. For optical lenses and LCD glass panels, surface micro‑defects induce light scattering, reducing light transmission and deteriorating display performance. Conventional larger‑particle polishing slurries cannot meet strict nano‑finish requirements for high‑end optoelectronic substrates.

Combining colloidal silica and colloidal alumina nano‑abrasives, this slurry achieves balanced chemical softening and gentle mechanical abrasion. The aqueous system offers excellent cooling performance during high‑speed planarization. The optimized dispersing formula effectively reduces the probability of scratch defects. It is applicable for single‑wafer CMP polishing equipment as well as large‑size glass flat polishing machines for optoelectronic substrates. Multiple particle‑size grades are available to satisfy different nano‑finishing stages from intermediate planarization to final mirror finishing.

During practical production, technicians can adjust working concentration by diluting concentrated slurry with ultra‑pure deionized water. Key process parameters including polishing down‑force, platen rotation speed, slurry flow‑rate and selection of dedicated polishing pad should be optimized according to substrate material and target surface roughness. Continuous recirculation with precision filtration is strongly recommended for mass‑production lines to remove micro‑debris generated during polishing.

Foreign contamination, prolonged high‑temperature storage and direct sunlight exposure must be strictly avoided. High‑temperature environment may trigger nano‑particle aggregation, which will introduce scratch risk during polishing operations.

Major application fields include nano‑level final finishing for semiconductor wafers, ultra‑smooth planarization of precision optical components, high‑quality surface polishing for LCD glass substrates.

Store the product in tightly‑sealed original plastic drums within 10‑25℃. Keep away from direct sunlight and intense heat sources. Gentle circulation stirring is required before use for long‑term stored batches.

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(JSYAPG-S001) Nano Polishing Slurry Colloidal Silica/Alumina Water-Based, for Semiconductor Wafer, Optics & LCD Nano-Finish

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.