JSYAPG‑SP3000 sapphire lapping slurry is a high‑efficiency rough lapping aqueous slurry for sapphire crystal substrates. Classified rigid inorganic abrasive particles are homogeneously dispersed in ultra‑pure aqueous medium, combined with specialized suspension agents, lubricants and surface conditioning additives. This product is suitable for C‑face, A‑face and R‑face sapphire wafer lapping with targeted material removal rate ranging from 20‑25µm/hr. It removes thick grinding layers rapidly and

Product Detail

Product Detail Page: JSYAPG‑SP3000 sapphire lapping slurry adopts precisely graded rigid inorganic abrasive as core functional material, evenly suspended within ultra‑pure aqueous base solution. Strict particle‑size classification and multi‑stage filtration are performed during manufacturing to eliminate oversized grit and hard agglomerates. Raw‑material purification minimizes ionic and heavy‑metal impurities to prevent surface contamination and staining on sapphire crystal. The integrated lubricating and suspension additive system reduces instantaneous frictional heat between lapping plate and hard sapphire wafer, and maintains stable abrasive suspension state throughout the lapping cycle.

Sapphire wafer fabrication consists of sequential slicing, rough lapping, fine lapping and final CMP. The rough‑lapping stage is responsible for quickly removing substantial thickness of damaged crystal layer generated during wafer slicing. Conventional high‑aggressiveness lapping slurries can realize fast material removal, yet they tend to introduce deep sub‑surface micro‑cracks. If these deep cracks remain after rough lapping, subsequent fine‑lapping and final‑polishing cycles require extended processing duration, which significantly reduces overall production throughput and increases manufacturing cost for LED substrates.

Formulated to balance high removal efficiency and crystal protection, this lapping slurry delivers stable material removal performance at 20‑25µm/hr for C‑face, A‑face and R‑face sapphire. Optimized abrasive morphology together with friction‑reducing lubricants helps to mitigate sharp mechanical impact on the crystal lattice. It removes slicing‑induced surface irregularities rapidly while limiting the depth of subsurface damage. The improved surface condition after rough lapping shortens the processing time for subsequent fine lapping and final CMP operations, raising overall productivity for sapphire substrate production lines.

Process technicians can dilute the concentrated stock slurry with ultra‑pure deionized water to adjust effective abrasive concentration. Lapping results can be further optimized by adjusting plate rotating speed, downward pressure and slurry feeding flow according to different double‑sided lapping equipment and production requirements.

Foreign chemical contamination, prolonged high‑temperature storage and freezing conditions must be strictly avoided. Freezing will break the suspension system and result in irreversible hard abrasive sedimentation. Once hard sediment cannot be re‑dispersed by agitation, the slurry is no longer usable for sapphire lapping.

Major application fields include rough lapping for C‑face, A‑face and R‑face sapphire LED substrates, pre‑treatment of optoelectronic sapphire crystal wafers, mass‑production lapping for sapphire substrate manufacturing.

Store the product in tightly‑sealed original plastic containers within 5‑30℃. Prevent direct sunlight and freezing environments. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term inventory to reduce hard bottom sediment.

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(JSYAPG-SP3000) Sapphire Lapping Slurry High Removal Rate 20–25µm/hr for Sapphire C/A/R-Face, Low Sub-Surface Damage

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.