JSYAPG‑WIN tungsten CMP slurry is a specialized chemical‑mechanical polishing slurry for semiconductor tungsten plug manufacturing. High‑purity inorganic abrasive is compounded with balanced oxidizing agents, complexing components and selective corrosion inhibitors. This slurry delivers high polishing selectivity between tungsten metal and surrounding oxide dielectric. It removes excess deposited tungsten while minimizing dishing, erosion and micro‑scratches, yielding atomic‑smooth, defect‑free

Product Detail

Product Detail Page: JSYAPG‑WIN tungsten CMP slurry consists of high‑purity inorganic abrasive uniformly dispersed in ultra‑pure aqueous medium, together with precisely calibrated oxidant, metal‑complexing agents and selective corrosion inhibitors. Multi‑stage precision filtration is carried out in the production workflow to remove oversized grit particles which would induce scratches on wafer surfaces. Rigorous raw‑material purification limits heavy‑metal and ionic contaminants to comply with intermediate‑level semiconductor manufacturing specifications. The proprietary additive system modulates the oxidation‑dissolution rate of tungsten versus silicon‑oxide dielectric to realize high material‑removal selectivity.

Tungsten plug technology provides vertical electrical interconnection between upper and lower device layers, which is a critical intermediate process for logic and memory chips. After tungsten deposition inside contact vias, surplus tungsten material on the dielectric surface needs to be completely eliminated by CMP. If polishing selectivity is insufficient, excessive dishing will occur on tungsten plugs. The concave topography of tungsten plugs increases contact resistance and deteriorates device electrical performance, resulting in unstable signal transmission and reduced product yield.

This slurry is formulated to preferentially remove tungsten while slowing down the material loss of surrounding oxide dielectric. It suppresses plug dishing and dielectric erosion, generating an atomic‑smooth wafer surface after planarization. The low‑defect surface condition reduces residual abrasive particles and polishing by‑products, alleviating the workload of subsequent post‑CMP wafer cleaning. A high‑quality planar surface provides reliable foundation for subsequent thin‑film deposition and photolithography steps.

Semiconductor process engineers can dilute the concentrated base slurry using ultra‑pure deionized water. Working concentration can be fine‑tuned by adjusting slurry dilution ratio, polishing down‑force and platen rotation speed to adapt to different CMP equipment platforms and mass‑production process windows.

Strong‑acid or strong‑alkali contamination, prolonged high‑temperature storage and freezing must be strictly avoided. Undesired foreign contaminants will disrupt the delicate balance of oxidizing agents and inhibiting additives, triggering particle flocculation, sedimentation and irreversible slurry degradation. Deteriorated slurry cannot be deployed for tungsten wafer polishing.

Major application fields include tungsten plug CMP for logic IC, tungsten contact planarization for memory chips, intermediate‑layer defect‑free wafer polishing for semiconductor manufacturing.

Store the product in tightly‑sealed original plastic containers within 5‑30℃. Prevent direct sunlight and freezing environments. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term inventory to mitigate bottom sediment accumulation.

Previous : (JSYAPG-SS12) CMP Slurry Colloidal Silica KOH-Based Ready-to-Use CAS 112926-00-8, Oxide Film Polish for Semiconductor Wafer Next : (JSYAPG-IDIE L) CMP Slurry Fumed Silica for ILD Interlayer Dielectric Planarization CAS 112945-52-5, High-Purity Advanced Node

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(JSYAPG-WIN) CMP Slurry Tungsten High Selectivity for Tungsten Plug, Atomic-Smooth Defect-Free Wafer Polish

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.