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Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 46μm Large‑Particle for CPO Potting & TIM High‑Loading
Large‑particle spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 46 μm. Produced by high‑temperature spheronization and precise classification, featuring stable alpha‑alumina crystal phase and smooth round particle shape. This thermally conductive inorganic filler is dedicated to CPO potting resin and high‑loading TIM formulations. Large spherical particles help to realize ultra‑high filling degree inside polymer matrix, constructing continuous heat‑transfer networks and significantly enhancing overa
Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 12μm for High‑Filling Thermal CPO & Heat Sink Substrate
Spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 12μm. It is produced by high‑temperature spheronization and multi‑stage air‑classification with stable alpha‑alumina crystal phase. This thermally conductive inorganic filler supports high loading within polymer matrix, forms continuous heat‑conducting pathways. It is used for high‑filling thermal resin, CPO semiconductor packaging and heat sink substrate composites to boost thermal dissipation and restrain thermal expansion of electronic thermal‑mana
Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 6.4μm for High‑Thermal Resin CPO & Automotive Electronics
Spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 6.4μm. Produced via high‑temperature spheronization and multi‑stage air classification, featuring stable alpha‑phase crystal structure and smooth spherical particle morphology. This thermally conductive inorganic filler establishes continuous heat‑transfer networks within resin matrix. It is applied in high‑thermal resin systems, CPO advanced semiconductor packaging and automotive electronics composites to enhance heat dissipation and improve long‑ter
Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4.9μm for CPO Thermal Management & High‑Conductive Plastic
Spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 4.9μm. Manufactured by high‑temperature spheronization and multi‑stage air classification to obtain round, stable alpha‑phase alumina particles. This thermally conductive inorganic filler builds continuous thermal conduction networks inside polymer matrix. It is used for CPO semiconductor thermal‑management materials and high‑conductive engineering plastic to improve heat dissipation, dimensional stability and melt flow during plastic processing.
Spherical Alumina Filler Low‑Sodium α‑Al₂O₃ CAS 1344‑28‑1, D50 1.9μm for TIM CPO Thermal Conductive Resin
Low‑sodium spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 1.9 μm. Produced by high‑temperature spheronization and strict purification to minimize sodium impurities. This inorganic thermal conductive filler is specially designed for TIM thermal interface material and CPO thermal‑conductive resin formulations. It improves thermal dissipation capacity of polymer matrix while maintaining favorable rheological property for advanced semiconductor thermal management.
Fumed Silica Nanopowder 5–50nm CAS 112945-52-5, High-Purity for CMP Sealant Liquid Resin & CPO Thixotropic
High‑purity fumed silica nanopowder, primary particle size 5‑50nm, CAS 112945‑52‑5. It is produced by high‑temperature flame hydrolysis of silicon‑based precursors. The nano‑sized silica network delivers prominent thixotropic and anti‑sedimentation effects. This functional inorganic nanopowder is applied for CMP sealant, liquid resin and CPO thixotropic systems to control slurry rheology, improve suspension stability and reinforce cured polymer matrix for semiconductor manufacturing materials.
Spherical Silica Filler Sol-Gel 0.1–1.5μm CAS 7631-86-9, Narrow PSD for CPO Underfill Low-Alpha Electronic Material
Sol‑gel spherical silica filler ranging 0.1‑1.5μm, CAS 7631‑86‑9. It is synthesized via sol‑gel wet‑chemistry route to obtain amorphous spherical silica featuring narrow particle‑size distribution. With deep purification to achieve low‑alpha performance, this inorganic filler is designed for CPO underfill encapsulant and high‑reliability electronic materials. It improves slurry rheology, lowers composite thermal expansion coefficient and suppresses alpha‑particle‑caused soft‑errors for microelec
High-Purity Spherical Fused Silica CAS 7631-86-9, Low-Radioactivity Low-Metal for Semiconductor Sealing & CPO
High‑purity spherical fused silica, CAS 7631‑86‑9. Manufactured by high‑temperature fusion, atomization and deep purification processes to realize low‑radioactivity and low‑metal specifications. This inorganic filler is dedicated to semiconductor sealing and CPO advanced packaging applications. It minimizes alpha‑particle emission risk for high‑density chips, lowers composite thermal expansion coefficient and maintains stable insulation performance for high‑reliability encapsulation resin system
Nano Spherical Silica Filler Liquid-Phase Synthesis CAS 7631-86-9, Monodisperse for OCA Optical CPO & Nanocomposite
Liquid‑phase‑synthesized monodisperse nano spherical silica filler (CAS 7631‑86‑9). It is fabricated through wet‑chemical liquid‑phase synthesis route to achieve extremely narrow particle‑size distribution and well‑defined spherical morphology without thermal‑fusion bead defects. This monodisperse silica filler is intended for OCA optical adhesive, optical‑grade CPO semiconductor packaging and high‑performance resin nanocomposite, optimizing thermal expansion, mechanical modulus and preserving h
Micron Spherical Silica Filler 1.3–1.7μm CAS 7631-86-9, for Electronic Encapsulation Coating & CPO Filler
Micron spherical silica filler featuring particle‑size range of 1.3‑1.7μm, CAS 7631‑86‑9. Produced via high‑temperature fusion spheronization and multi‑stage air classification to form uniform amorphous spherical silica particles. It serves as key inorganic filler for electronic encapsulation coating and CPO semiconductor packaging, improving dimensional stability, reducing shrinkage and providing consistent electrical insulation within cured resin systems.
Submicron Spherical Silica Filler 0.9–1.2μm CAS 7631-86-9, for EMC CPO High-Filling Low-Viscosity Resin
Submicron spherical silica filler ranging 0.9‑1.2μm, CAS 7631‑86‑9. Manufactured by high‑temperature fusion and precise air‑classification to obtain uniform amorphous spherical particles. The filler permits high mineral loading while keeping favorable resin fluidity, and is applied in EMC and CPO high‑filling low‑viscosity encapsulation resin to lower thermal expansion and enhance the mechanical reliability of semiconductor packages.
Nano Spherical Silica Filler VMC Process 0.2–0.4μm CAS 7631-86-9, Low-Alpha for CPO EMC & Optical Adhesive
VMC‑processed nano spherical silica filler, particle‑size 0.2‑0.4μm, CAS 7631‑86‑9. Adopting specialized VMC manufacturing workflow, this low‑alpha amorphous spherical silica restricts alpha‑particle emission. It is designed for CPO EMC semiconductor encapsulation and optical adhesive, lowering soft‑error incidence for memory‑related chips while maintaining high light transmittance in optical bonding resin systems.
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
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