Thermal Grease CAS 63148-62-9, Silicone with Thermal Filler for CPU GPU IGBT Power Module TIM Cooling
This thermal grease is a silicone‑matrix thermal interface material. It is formulated with silicone base fluid, high‑thermal‑conductivity inorganic filler and anti‑oxidant stabilizing additives. The tightly packed thermal filler creates efficient heat‑conducting pathways inside the silicone matrix. The grease fills micro‑irregularities between heat‑generating chips and heat sinks, reducing thermal contact resistance. It provides reliable thermal dissipation protection for CPU, GPU, IGBT and othe
Product DetailsThermal Grease CAS 63148‑62‑9, Silicone with Thermal Filler for CPU GPU IGBT Power Module TIM CoolingThis thermal grease is compounded with silicone base fluid, dedicated thickener, high‑thermally‑conductive inorganic filler and anti‑oxidant stabilizers. The particle‑size graded thermal fillers are uniformly dispersed within the silicone medium to construct continuous heat‑transfer networks. Silicone base fluid delivers stable performance across a broad operating temperature range and resists thermal ageing. Careful filler grading helps balance thermal conductivity and proper spreadable viscosity to avoid excessive thickening.
When applied between chip surfaces and heat‑sink bases of CPU, GPU and IGBT power modules, the grease squeezes into microscopic valleys and gaps of the mating metal surfaces. It eliminates trapped air pockets which act as thermal insulators, effectively lowering overall thermal contact resistance. Continuous heat can transfer rapidly from hot electronic components toward the heat sink, preventing local hot‑spot formation on power semiconductor modules during high‑load operation.
Under long‑term thermal cycling inside electronic devices, the grease maintains suitable consistency and exhibits good anti‑pump‑out property, minimizing oil bleeding. Anti‑oxidant additives slow down thermal degradation of the silicone carrier, restraining performance drop after prolonged service. The formulation shows good compatibility with common metal heat‑sink substrates and plastic housing materials of power modules.
It is suitable for manual or screen‑printing dispensing as thermal interface material during assembly of CPU, GPU, IGBT and industrial power modules. The coating thickness must be strictly controlled. An overly thick grease layer will increase total thermal resistance and weaken cooling efficiency; an excessively thin layer cannot fully fill surface micro‑gaps and leaves residual air insulation, resulting in insufficient heat dissipation.
Do not mix this silicone thermal grease with hydrocarbon lubricants, lithium‑based greases or fluorosilicone greases. Incompatible blending breaks the graded‑filler distribution, damages thermal conductive networks and accelerates oil separation under thermal cycling. Store in tightly sealed original containers inside cool, dry indoor warehouse. Avoid prolonged high‑temperature storage to preserve thermal‑transfer performance for CPU, GPU, IGBT and power module TIM cooling applications.
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