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Lithium Magnesium Silicate Powder Medium-Transparency CAS 67142-95-4, Synthetic Hectorite for Water-Based Paint Coating & Daily Chemical
Lithium Magnesium Silicate Powder, medium‑transparency synthetic hectorite, CAS 67142‑95‑4. It is produced by hydrothermal synthesis, moderate purification and spray‑drying. When dispersed into aqueous medium, the powder exfoliates into silicate nanosheets and builds reversible thixotropic colloidal networks. This grade is dedicated to water‑based paint, coating and daily‑chemical formulations, providing effective suspension, anti‑sagging and storage stabilization for pigment‑containing systems.
High-Purity Lithium Magnesium Silicate Powder CAS 67142-95-4, Clear Water-Soluble Rheology Modifier for Premium Coating Ink & Optical Gel
High‑Purity Lithium Magnesium Silicate Powder, CAS 67142‑95‑4. This synthetic hectorite is produced by hydrothermal synthesis, deep purification and spray‑drying. Low content of heavy‑metal and insoluble residues ensures high clarity after aqueous exfoliation. It functions as a water‑soluble inorganic rheology modifier, providing thixotropy, anti‑sagging and suspension stabilization for premium water‑based coatings, printing inks and transparent optical gel systems.
Lithium Magnesium Silicate Thickener Water‑Clear CAS 67142‑95‑4, Synthetic Hectorite for Transparent Gel Toothpaste & Skincare Serum
Lithium Magnesium Silicate Thickener, water‑clear synthetic hectorite, CAS 67142‑95‑4. It is synthesized via hydrothermal reaction, refined purification and spray‑drying. After dispersion and hydration in aqueous media, nanoscale silicate sheets exfoliate to build reversible thixotropic gel networks. The product serves as thickener, suspending agent and stabilizer for transparent gel toothpaste and skincare serum, preventing phase separation and sedimentation while maintaining excellent visual t
Lithium Magnesium Silicate Powder High-Transparency CAS 67142-95-4, Synthetic Hectorite Water-Soluble Clear Gel for Cosmetics & Personal Care
Lithium Magnesium Silicate Powder, high‑transparency synthetic hectorite, CAS 67142‑95‑4. It is a synthetic nanoscale layered silicate manufactured under hydrothermal synthesis, purification and spray‑drying. Upon hydration in water or hydro‑alcohol solutions, the powder exfoliates into nanosheets and builds up a clear thixotropic gel network. It functions as rheology modifier, suspending agent and stabilizer for transparent cosmetic and personal‑care formulas, preventing sedimentation of insolu
CPO Optical Encapsulant High-Refractive Index with Nano Spherical Silica, for Photonic Chip Fiber Coupling Low-Stress
CPO Optical Encapsulant is a high‑refractive index curable resin system modified with uniformly dispersed nano spherical silica filler. The nano‑sized spherical silica reduces curing shrinkage and modulus, enabling low‑stress performance. This optical encapsulant is intended for the photonic‑chip‑fiber coupling zone of CPO assemblies. It maintains precise optical alignment, minimizes optical losses and enhances long‑term thermomechanical reliability of high‑speed optoelectronic interconnection s
High-End CPO Encapsulation Powder Low-Alpha Silica AlN BN Blend, for HBM GPU CPO Optical Module High-Thermal
High‑End CPO Encapsulation Powder is a tailor‑made multi‑component inorganic blend consisting of low‑alpha spherical silica, aluminum nitride and hexagonal boron nitride. Rigorous raw‑material screening and homogenized blending deliver ultra‑low alpha‑particle emission together with outstanding thermal‑conductive performance. This filler blend is dedicated to high‑thermal epoxy molding compound for HBM‑GPU integrated CPO optical modules, reducing soft‑error incidents of high‑speed memory chips w
CPO Encapsulation Filler Spherical Silica-Alumina Blend Multi-Modal, Low-Expansion High-Thermal for EMC General Filling
CPO Encapsulation Filler is a multi‑modal blended inorganic filler composed of spherical silica and spherical alumina fractions with different particle‑size distributions. Optimized particle‑size grading enables high loading within epoxy molding compound. This filler features low coefficient of thermal expansion and improved thermal conductivity. It is used for EMC general filling to reinforce CPO encapsulation systems, reducing thermal‑induced stress and enhancing long‑term reliability of co‑pa
CPO Encapsulation Compound Epoxy/Silicone Resin with Spherical Filler, for Co-Packaged Optics Sealing Moisture Insulation
CPO Encapsulation Compound is a composite sealing material formulated with epoxy or silicone resin matrix and graded spherical inorganic fillers. Through precise multi‑modal particle‑size formulation, this encapsulation compound achieves balanced rheological behavior, low moisture permeability and favorable mechanical properties. It is applied for sealing and moisture insulation of co‑packaged optics assemblies, protecting photonic chips and high‑speed optical interconnection components against
Nano Cerium Oxide Polishing Powder CAS 1306-38-3, for CPO Wafer Glass Optical End-Face Precision Lapping
Nano Cerium Oxide Polishing Powder, CAS 1306‑38‑3. It is synthesized by wet‑chemical precipitation, controlled calcination, de‑agglomeration and fine classification. This ultrafine rare‑earth oxide powder has narrow nano‑sized particle distribution, moderate hardness and excellent chemical‑mechanical reactivity. It serves as precision lapping abrasive for CPO wafer, optical glass and component end‑face finishing, delivering low‑scratch surface quality for high‑performance optoelectronic assembli
Cerium Oxide Powder High-Purity CAS 1306-38-3, for CPO Optical Module Filler CMP & Glass Polish
High‑purity cerium oxide powder, CAS 1306‑38‑3. Produced by rare‑earth precipitation, calcination, pulverization and precise classification. This rare‑earth oxide powder possesses outstanding chemical‑mechanical polishing performance, UV‑shielding capacity and good chemical inertness. It serves as multi‑functional material for CPO optical module resin filler, CMP chemical‑mechanical polishing and industrial glass polishing applications in optoelectronic manufacturing.
High-Thermal Boron Nitride Powder h-BN CAS 10043-11-5, for CPO Thermal Filler & BN Molded Product Raw Material
High‑thermal boron nitride powder h‑BN, CAS 10043‑11‑5. It is produced by high‑temperature solid‑state synthesis, thermal annealing, purification and particle classification. This flaky hexagonal boron nitride powder features outstanding thermal conduction performance, low dielectric constant and excellent high‑temperature resistance. It can be used as functional thermal filler for CPO resin‑based packaging composites, and also as sintering feedstock for hot‑pressed BN molded ceramic parts for o
Spherical Agglomerated Boron Nitride Filler CAS 10043-11-5, D50 35–300μm High-Flow for CPO Potting & Dielectric
Spherical agglomerated boron nitride filler, CAS 10043‑11‑5, D50 35‑300 μm. It is produced by granulating fine hexagonal boron nitride flakes with temporary binder, thermal sintering and post‑sieving classification. Each spherical granule consists of tightly packed h‑BN micro‑flakes. This filler combines high thermal conductivity, outstanding flow‑ability and reliable dielectric insulation. It is used for CPO potting resin and dielectric composite formulations, enabling high filler loading and i
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