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Hexagonal Boron Nitride Powder Coarse CAS 10043-11-5, D50 8.5μm for CPO High-Thermal Filler & Isotropic Potting
Coarse hexagonal boron nitride powder, CAS 10043‑11‑5, D50 8.5 μm. Produced via high‑temperature synthesis, thermal annealing, crushing and multi‑step air classification. This flaky coarse h‑BN powder delivers prominent thermal conductivity and outstanding dielectric performance. It is applied as high‑thermal inorganic filler for CPO isotropic potting resin, enhancing heat‑spreading capacity and mitigating thermal‑induced internal stress inside high‑density optoelectronic packaging assemblies.
Hexagonal Boron Nitride Powder Fine CAS 10043-11-5, D50 1.2μm for CPO Thermal Filler Lubricant & Insulating
Fine hexagonal boron nitride powder, CAS 10043‑11‑5, D50 1.2 μm. It is manufactured through high‑temperature synthesis, purification, fine milling and precise air classification. This fine flaky h‑BN powder features outstanding thermal conductivity, good lubricating slip property and superior electrical insulation. It serves as multi‑functional additive for CPO optoelectronic packaging materials, acting as thermal filler, internal lubricant and insulating modifier inside resin and composite syst
Spherical Silicon Nitride Filler CAS 12033-89-5, High-Filling Low-Wear for CPO High-Thermal EMC & Reliable Encapsulation
Spherical silicon nitride filler, CAS 12033‑89‑5. Produced by high‑temperature spheroidization treatment of silicon nitride raw powder, followed by purification and precise classification. This spherical non‑oxide ceramic filler combines moderate thermal conductivity, low particle abrasiveness and excellent mechanical rigidity. It is used for CPO high‑thermal EMC epoxy molding compound and reliable encapsulation resin, allowing high‑loading formulation, lowering processing wear and enhancing lon
Silicon Nitride Powder High-Purity CAS 12033-89-5, High-Strength Toughness for CPO Structural Ceramic & Thermal Filler
High‑purity silicon nitride powder, CAS 12033‑89‑5. Produced through high‑temperature direct nitridation, fine grinding, impurity removal and precise particle classification. This non‑oxide ceramic powder provides outstanding fracture toughness, moderate thermal conductivity and low thermal expansion. It can be adopted as sintering feedstock for CPO structural ceramic components as well as functional thermal filler inside resin systems to enhance mechanical durability and heat‑dissipation perfor
Aluminum Nitride Ceramic Substrate High-Thermal CAS 24304-00-5, for Power Module High-Frequency CPO Optical Heat Sink
High‑thermal aluminum nitride ceramic substrate, CAS 24304‑00‑5. It is fabricated from high‑purity AlN powder through tape‑casting, lamination, high‑temperature sintering and precision finishing. This dense ceramic substrate delivers high thermal conductivity, low dielectric loss and superior electrical insulation. It serves as core thermal spreading base for power modules, high‑frequency circuits, CPO optical packaging and optical heat‑sink components, releasing concentrated heat of high‑power
Aluminum Nitride Filler High-Thermal CAS 24304-00-5, for CPO High-Conductive EMC Encapsulation & Insulating Resin
High‑thermal aluminum nitride filler, CAS 24304‑00‑5. Manufactured by carbothermal nitridation synthesis, followed by grinding, surface passivation and precise particle classification. This inorganic nitride filler delivers high thermal conductivity together with superior electrical insulation. It is incorporated into CPO high‑conductive EMC molding compound and insulating resin systems to improve heat dissipation, reduce thermal expansion and reinforce polymer matrix for high‑density semiconduc
Aluminum Nitride Powder High-Purity CAS 24304-00-5, Thermal Conductivity 180–200W/mK for CPO Substrate & TIM
High‑purity aluminum nitride powder, CAS 24304‑00‑5, intrinsic thermal conductivity 180‑200W/mK. It is synthesized via carbothermal reduction nitridation process, followed by de‑agglomeration and precise classification. This nitride ceramic powder features excellent thermal conductivity and superior electrical insulation. It is used as raw material for CPO ceramic substrates and functional filler for TIM thermal‑interface materials, supporting high‑efficiency heat dissipation for high‑density an
Fused Alumina Powder White Fused Alumina CAS 1344-28-1, High-Hardness for Lapping Electronic Ceramic & CPO Filler
White fused alumina powder, CAS 1344‑28‑1. It is produced by electric‑arc high‑temperature fusion, crushing, milling and precise classification. This high‑hardness α‑alumina powder possesses sharp angular crystal grains. It functions both as lapping abrasive powder for electronic ceramic and rigid inorganic filler for CPO semiconductor packaging composites, providing abrasive cutting action for precision grinding and enhancing mechanical rigidity of cured polymer‑based electronic components.
Calcined Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4‑4.9μm for EMC CPO Encapsulation & Resin Filler
Calcined α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 4‑4.9 μm. It is produced by high‑temperature calcination, milling and multi‑stage classification to form stable alpha‑phase alumina particles. This inorganic filler is used for EMC epoxy molding compound, CPO advanced semiconductor encapsulation and general thermoset resin. It improves hardness, dimensional stability and thermal conductivity of cured resin while controlling expansion coefficient for microelectronic packaging applications.
Near‑Spherical Single‑Crystal Alumina CAS 1344‑28‑1, for TIM CPO Thermal Grease & High‑Thermal Conductive Filler
Near‑Spherical Single‑Crystal Alumina, CAS 1344‑28‑1. It is produced by high‑temperature crystal growth, controlled crushing and precise classification. This single‑crystal alumina exhibits near‑spherical particle morphology without full spheronization. It acts as high‑thermal‑conductive inorganic filler for TIM thermal interface materials, CPO thermal grease and polymer thermal composites, improving thermal conductivity while maintaining good fluidity of grease and paste‑type thermal systems.
Ultrafine Alpha Alumina Powder 4N CAS 1344‑28‑1, D50 ≤0.15μm for CPO Nanocomposite & High‑End Ceramic
4N ultrafine alpha alumina powder, CAS 1344‑28‑1, D50 ≤0.15 μm. It is produced by high‑temperature controlled calcination, ultrafine milling and multi‑stage purification. This high‑purity α‑Al₂O₃ powder features fine primary particle dimension and high sintering activity. It is used as reinforcing filler for CPO nanocomposite and raw material for high‑end technical ceramic, improving mechanical strength, thermal stability and electrical insulation of finished electronic components.
High‑Purity Alpha Alumina Powder 4N CAS 1344‑28‑1, D50 0.1μm Na<2ppm for CMP Phosphor & CPO Precision Ceramic
4N high‑purity alpha alumina powder, CAS 1344‑28‑1, D50 0.1 μm, sodium content less than 2 ppm. It is produced via precise thermal calcination and multi‑step deep purification. The ultrafine alpha‑phase alumina features extremely low alkali‑metal contamination. This functional powder is applied for CMP polishing media, phosphor raw materials and CPO precision ceramic components, minimizing lattice defects and supporting high‑grade optoelectronic and semiconductor ceramic manufacturing.
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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
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