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High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging
High‑Temp Encapsulation Release Powder Montan Wax/PTFE Blend is a high‑performance solid internal release additive compounded with refined montan wax and fine‑grade PTFE powder. Synergistic blending significantly improves the thermal stability compared with single montan‑wax‑based release agents. During high‑pressure encapsulation molding above 300℃, a controlled fraction migrates moderately to the mold interface and builds a thin lubricating isolating layer. Its low‑bleed property restrains sur
Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding
Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive designed for epoxy molding compound in semiconductor IC encapsulation. It shows moderate compatibility with epoxy resin, curing agent and fused silica filler system. During high‑temperature transfer molding, only a controlled portion migrates towards the mold interface to build an ultra‑thin lubricating isolating layer for clean demolding. Optimized molecular structure effectively restrains excessive su
Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic
Mold Anti‑Carbon Release Agent High‑Temp Ester‑Modified Silicone is a high‑performance modified silicone releasing material with ester functional groups grafted onto siloxane molecular backbone. The ester modification optimizes high‑temperature thermal stability of silicone. During repeated hot vulcanization of rubber and high‑temperature thermoset‑plastic molding, it forms a continuous thin lubricating isolating film on mold cavity surfaces. It suppresses the formation of hard carbonized foulin
Wind Turbine Fiberglass Release Agent Semi-Permanent Fluorosilicone, Large-Size Compression Multi-Release No Residue
Wind Turbine Fiberglass Release Agent Semi‑Permanent Fluorosilicone is a high‑performance cross‑linkable fluorosilicone releasing material designed for oversized fiberglass composite components used in wind‑power equipment. After proper application and thermal curing on mold surfaces, it creates a durable, low‑surface‑energy isolating film. This cured film delivers stable multi‑release performance for large‑size FRP compression molding. It minimizes transfer residues onto fiberglass workpieces.
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043‑11‑5 is a high‑purity composite inorganic functional filler. It combines the layered lubricating property of hexagonal boron nitride and the reinforcing effect of nano silica after special surface modification treatment. When mixed into rubber or polymer formulations, it disperses evenly within the matrix. During high‑temperature vulcanization and molding, part of the fine powder migrates moderately toward the mold interface a
High-Temperature IC Encapsulation Release Agent Fluorosilicone, 350℃ No Decomposition No Carbon Build-Up
High‑Temperature IC Encapsulation Release Agent Fluorosilicone is a high‑purity fluorosilicone‑based mold‑release material dedicated to harsh high‑temperature IC encapsulation conditions. The fluorine‑modified siloxane backbone delivers outstanding thermal stability. Under peak working temperature up to 350℃, it resists molecular decomposition and prevents stubborn carbon build‑up on precision mold cavities. During epoxy molding compound transfer‑molding cycles, it forms an ultra‑thin lubricatin
Water-Based Fiberglass Mold Release Agent Silicone-Fluoro Emulsion, Multi-Release Eco for FRP Compression Molding
Water‑Based Fiberglass Mold Release Agent Silicone‑Fluoro Emulsion is a waterborne non‑solvent functional release emulsion composed of modified silicone and fluorinated components stabilized by selected non‑ionic emulsifiers. When sprayed onto mold surfaces and fully dried, it develops a tough thin isolating film. The formulated film enables multi‑release performance for FRP compression molding processes including SMC and BMC. Without volatile organic solvents, this eco‑friendly product reduces
High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging
High‑Temp Encapsulation Release Powder Montan Wax/PTFE Blend is a solid composite release additive combining refined montan wax and low‑molecular‑weight PTFE powder. Synergistic combination improves thermal stability compared with conventional single wax‑type release agents. During high‑pressure encapsulation molding above 300℃, it achieves moderate migration toward mold interface to form a thin lubricating isolating layer. It features low bleed property to minimize surface exudation. It is suit
Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding
Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive developed for epoxy molding compound used in semiconductor IC encapsulation. It features well‑balanced compatibility with epoxy resin, curing agents and inorganic silica fillers. During high‑temperature transfer molding, the additive migrates moderately toward the mold‑metal interface to build an ultra‑thin lubricating isolation layer for clean demolding. Strict molecular design minimizes excessive surf
Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic
Mold Anti‑Carbon Release Agent High‑Temp Ester‑Modified Silicone is a high‑performance functional silicone release material with ester group modification on the siloxane molecular chain. The ester modification improves thermal stability and interfacial compatibility. At prolonged high‑temperature vulcanization and thermoplastic molding conditions, it inhibits the formation of stubborn carbonized deposits inside mold cavities. It builds a uniform lubricating isolating film during molding to reali
Wind Turbine Fiberglass Release Agent Semi-Permanent Fluorosilicone, Large-Size Compression Multi-Release No Residue
Wind Turbine Fiberglass Release Agent Semi‑Permanent Fluorosilicone is a high‑performance fluorosilicone‑based semi‑permanent mold‑release material, specially developed for oversized fiberglass composite parts of wind turbine equipment. After proper curing on mold surfaces, it creates a tough, continuous isolating film. This robust coating enables multi‑release cycles for large‑size FRP compression molding. It avoids heavy surface residues on fiberglass workpieces, facilitating subsequent sandin
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding
Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043‑11‑5 is a high‑purity composite inorganic functional powder. It combines layered lubricating property of hexagonal boron nitride with high‑rigidity nano‑silica. Surface modification optimizes dispersion inside rubber and polymer matrix. During high‑temperature molding and vulcanization, it delivers solid lubrication and internal mold‑release effect. It avoids carbon‑forming decomposition risks common to organic wax‑based relea
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