Products Center
Extreme Thermal Grease 6.0W/mK CAS 63148-62-9, Anti-Pump-Out for Bare Die TIM1.5 AI Chip High-Reliability Cooling
This 6.0W/mK extreme thermal grease is a high‑performance silicone‑based thermal interface compound. The specially adjusted thixotropic filler system delivers prominent anti‑pump‑out capability. It is targeted for bare‑die TIM1.5 application of AI chips. The grease resists interface displacement caused by repeated thermal expansion‑contraction, sustains consistent heat conduction, and fulfils high‑reliability cooling requirements for advanced high‑power semiconductor chips.
Ultra-High Thermal Grease 5.2W/mK CAS 63148-62-9, Grey Non-Flowing for MPU Power Module High-Power Chip Cooling
This 5.2W/mK ultra‑high thermal grease is a grey silicone‑based thermal interface compound with non‑flowing thixotropic property. Optimized high‑loading thermally‑conductive filler system delivers outstanding heat‑transfer capability. It avoids grease sagging and dripping on vertical or inclined assembly surfaces, fills micro gaps between chips and heat‑dissipation structures, and offers durable cooling performance for MPU, power modules and high‑power semiconductor chips.
High-Thermal Conductivity Grease 4.3W/mK CAS 63148-62-9, Low Thermal Resistance for CPU GPU Power Semiconductor TIM
This 4.3W/mK high‑thermal‑conductivity grease is a silicone‑based thermal interface compound with low thermal resistance. Optimized filler dispersion delivers superior heat transfer performance. It fills microscopic surface irregularities between chips and heat sinks, expels trapped air, and provides consistent TIM performance for CPU, GPU and power semiconductor components under high‑load continuous operating conditions.
Thermal Grease Medium Thermal Conductivity 3.2W/mK CAS 63148-62-9, Non-Cure for MPU Power Module TIM1 TIM2
This 3.2W/mK medium thermal conductivity thermal grease is a non‑curing silicone‑based thermal interface compound. It is specially engineered to serve as TIM1 and TIM2 material for MPU and power module assemblies. The grease conforms to uneven mating surfaces, eliminates trapped air gaps between heat‑generating chips and heat dissipating structures, lowers thermal contact resistance, and sustains reliable continuous heat dissipation during long‑duration module operation.
Mold Release Silicone Grease CAS 63148-62-9, Dimethyl Silicone Compound for Rubber Plastic Demolding Die Lubrication Anti-Stick
This mold release silicone grease is a dimethyl silicone‑based compound developed for molding processes. It forms a thin slippery anti‑stick film on hot die surfaces during production. The grease minimizes adhesion between mould cavity and molded rubber or plastic parts, provides effective die lubrication, reduces surface defects on finished components, and supports continuous high‑volume molding operations.
Thermal Grease Heat Sink Compound 0.7W/mK CAS 63148-62-9, Non-Melt White for PCB IGBT Electronic Heat Dissipation
This 0.7W/mK white thermal grease heat sink compound is a silicone‑based thermal interface material. With non‑melt characteristic, it fills micro‑irregularities between heat‑generating electronic chips and heat sinks. It reduces thermal contact resistance on PCB and IGBT assemblies, conducts waste heat rapidly away from hot components, and delivers stable long‑term electronic heat dissipation performance under continuous operating loads.
Electrical Insulating Silicone Grease CAS 63148-62-9, High-Dielectric for Ignition System High-Voltage Joint Electronic Moisture Seal
This electrical insulating silicone grease is a dielectric‑grade silicone‑based lubricating and sealing compound. It possesses excellent high‑dielectric properties to resist high‑voltage breakdown. The grease displaces residual moisture and forms a continuous protective barrier at high‑voltage joints, ignition system interfaces and electronic connection points. It suppresses leakage current, prevents creepage and flash‑over, and delivers long‑term moisture‑proof sealing for exposed electrical co
High-Vacuum Silicone Grease CAS 63148-62-9, Low-Vapor-Pressure Low Volatile for Vacuum System O-Ring Sealing Vacuum Valve
This high‑vacuum silicone grease is a specialized sealing‑lubricating compound formulated for vacuum equipment. Featuring extremely low vapor pressure and low volatile characteristics, it effectively suppresses outgassing under high‑vacuum conditions. The grease delivers stable lubrication for vacuum valves and O‑ring sealing interfaces, prevents leakage at sealing joints, and minimizes contamination inside vacuum chambers. It maintains consistent grease texture during long‑term operation of vac
Silicone Grease Valve Seal CAS 63148-62-9, PDMS-Based NLGI 2 for Control Valve O-Ring Vacuum System Outdoor Corrosion Protection
This PDMS‑based NLGI 2 silicone grease is a premium sealing and lubricating compound. It delivers stable grease consistency under fluctuating ambient conditions. The product is engineered for sealing and lubrication of control valves and O‑ring components within vacuum systems, while offering effective outdoor anti‑corrosion performance for metal and elastomer parts. It features good elastomer compatibility, low tendency to harden or bleed, and maintains sealing capability under continuous outdo
Multi-Modal Spherical Alumina Powder Blend CAS 1344-28-1, Ternary Particle Size for Maximum Packing & High-Thermal EMC
Multi‑Modal Spherical Alumina Powder Blend CAS 1344‑28‑1 is a ready‑to‑use ternary graded spherical α‑Al₂O₃ blend. It is produced by precise metered mixing of coarse, medium and fine spherical alumina fractions after independent classification and purification. The graded particle‑size design maximizes packing density. It serves as pre‑mixed thermally‑conductive filler for high‑thermal semiconductor EMC, simplifying compound formulation work while enhancing thermal dissipation and dimensional st
CMP Grade Spherical Alumina Powder CAS 1344-28-1, Nano α-Al₂O₃ for Wafer Glass Optical Precision Polishing
CMP Grade Spherical Alumina Powder CAS 1344‑28‑1 is high‑purity nano spherical alpha‑alumina manufactured by controlled hydrothermal synthesis, plasma spheroidization and multi‑stage fractional classification. Strict removal of oversized rogue particles ensures narrow particle‑size distribution. Uniform nano‑spherical grains deliver mild and consistent cutting action. It serves as key solid abrasive for CMP polishing slurry, applied on semiconductor wafer, flat glass and precision optical compon
Gamma Spherical Alumina Powder CAS 1344-28-1, Porous γ-Al₂O₃ for Catalyst Carrier Adsorbent & Coating
Gamma Spherical Alumina Powder CAS 1344‑28‑1 is porous spherical γ‑Al₂O₃ manufactured via sol‑gel forming, spray spheroidization and controlled low‑temperature calcination. It maintains abundant interconnected pore channels and high specific surface area without transforming into dense alpha‑phase alumina. Good spherical flow‑ability reduces dust generation. It serves as functional raw material for catalyst carrier, adsorbent purification media and special industrial coating, enabling active com
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
